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SKU: #001 - In Stock

  • airport Shipping:  International shipping available
  • delivery_food Shipping time:   Standar(10-20 business days), Rush(5-10 business days)
  • chip Discount:  Get 2% discount on orders of USD $100.00,Get 3% discount on orders of USD $200.00
  • compass Handling time:  Ships within 3 business days after receiving cleared payment
  • available_updates Returns:  7 days money back guaratee,buyer pays return shipping

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5G NR BBU is used to realize 5G NR base station processing unit, centrally control and manage the entire base station system, realize direct access and data interaction with 5G core network, realize NGAP, XnAP interface, and realize 5G NR access network protocol stack function, RRC , PDCP, SDAP, RLC, MAC and PHY protocol layer functions, baseband processing functions.


Product Specifications

1.1  Hardware Features

• Support 2x Intel® Xeon® Scalable Silver/Gold processors, up to 125W TDP

• Support 16x DDR4 2133/2400/2666 ECC memory with parity, up to 512GB

• Flexible platform to meet expansion/configuration needs

a) Built-in Intel® QAT

b) Storage interface: 3x 2.5″ SATA 6 Gb/s, 1x M.2 SATA

c) PCIe expansion: 2x PCIe x16 Gen3

d) TPM 1.2/ 2.0 module

• 420mm deep, 1/2U 19-inch rack mount interface, very suitable for the deployment of communication infrastructure

• Advanced chassis management, compatible with IPMI v2.0

1.2  Interface (front access)

1.2.1  IO Interface

• 2x RJ-45 10/100/1000BASE-T Ethernet port

• 4x 10G SFP+ Ethernet port

• 1 x VGA

• 1x RJ-45 serial port

• 2x USB 3.0

• Power, alarm and drive status

1.2.2  Extension Ports

• 2x PCIe x16 (single slot FHFL) 2x PCIe x16 (dual slot FHFL).

• storage

a) Drive slot

b) 1x onboard M.2 slot

c) 3x 2.5” hot-swappable SATA 6 Gb/s drive slot

1.2.3  Environment

• Fans: 3 fans, adaptive speed

• Power: 800W or 1200W

a) 100V-240V AC @50-60Hz

b) 36V ~ -72V DC

c) 240V-310V HVDC

• Temperature and Humidity

a) During operation: -5°C ~ +55°C, 10%-85% RH @40°C, non-condensing (depending on the inserted PCIe card)

b) Storage: -40°C ~ +70°C, 5%-90% RH, non-condensing (depending on the PCIe card inserted)

• Impact

a) During operation: half sine 2G, 11ms pulse, 100 pulses in each direction

b) Non-operating time: trapezoid, 25G, 170 inches/sec Delta V, 3 drop tests in each direction

• Vibration

a) Non-operating time: 2.2Grms, 10 minutes per axis per direction

• Decibel

a) Sound pressure <75 dBA @1m, when all fans are running at maximum speed


Performance Parameter

No. Description Parameter
1 Standard 3GPP R15
2 Server Platform Xeon Gold 5120 processor @2.42HzSupport other chip platforms
3 RF Front End RRU with FPGA/DSP
4 RF Front End 10GE
5 Fronthaul Interface <6 GHz
6 Frequency 100 MHz
7 System Bandwidth TDD
8 Duplex Mode 30kHz
9 BS spatial layers 4
10 UE spatial layers 2
11 Downlink Peak Rate 1.5Gbps (ideal conditions)
12 Uplink Peak Rate 260Mbps (ideal conditions)
13 No. of Scheduled Users 8 Users / Slot

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